Abstract: The rapid development of the solar photovoltaic and the electronics industry has put forward higher requirements for the cutting of hard-brittle semiconductor materials such as crystalline silicon. To further improve the cutting quality and production efficiency of hard and brittle semiconductors and reduce the production cost, diamond wire saw electrical discharge composite sawing has been applied to hard and brittle semiconductor cutting. In this paper, the research progress of this composite sawing technology of hard and brittle semiconductor materials is reviewed from the processing principle, process performance and influencing factors, and the future development and research direction are prospected.