Abstract: This study proposes an innovative simulation method to address quality control issues in the reflow soldering process by analyzing the temperature field. The method considers the influences of thermal convection and thermal radiation, utilizing a single-temperature chamber as the reflow oven and PCB components as the soldered objects. Ansys Icepak software is employed to simulate the reflow soldering process, and an oven temperature test platform is built to monitor the temperature profiles of PCB components, facilitating quality analysis of soldering. The simulation model effectively replicates the reflow temperature distribution among different process parameter groups (A to C), consistently matching the measured temperature profiles. Notably, process parameter group A yields superior solder quality. This innovative approach achieves effective quality control, providing a theoretical foundation for optimizing the reflow soldering process and facilitating adjustments to enhance both soldering performance and productivity. Furthermore, it offers valuable insights for controlling temperature fields in similar processes, making it a valuable reference for various manufacturing applications in the electronics industry.