单晶镍纳米切削材料去除行为与机理研究

Study on the material removal behaviors and mechanisms in nano-cutting of single crystal nickel

  • 摘要: 单晶镍纳米尺度加工时的材料去除机理对实现其超精密加工尤为重要。为此,借助分子动力学仿真研究单晶镍纳米切削时的力热行为、表面/亚表面形成特征以及塑性变形机制以揭示材料去除机理。结果表明单晶镍纳米切削时,有序的镍原子在刀具挤压和剪切作用下以非晶结构的形式被去除,部分具有面心立方(face center ‌cubic, FCC)结构的镍原子转变成密排六方(hexagonal close-packed, HCP)结构和非晶结构,主导了相变与非晶化;同时出现伯氏矢量分别为1/6<112>、1/3<100>、1/6<110>、1/3<111>以及1/2<110>的位错线。单晶镍纳米切削时的塑性变形机制为相变、非晶化和位错滑移。在切削过程中,由于几何条件与能量条件被同时满足,发生1/2<110>全位错转变为1/6<112>不全位错的位错反应。在切削力热的作用下,已加工亚表面出现了位错环、梯杆位错、棱住位错、V型位错、原子团簇和空位等缺陷结构。相比于(100)晶面和(110)晶面,沿(111)晶面切削有利于减小亚表面缺陷层深度。

     

    Abstract: It is especially important to achieve the material removal mechanism during nanoscale machining to realize ultra-precision machining of single crystal nickel. Therefore, the mechanical and thermal behavior, surface/subsurface formation characteristics and plastic deformation mechanism of single crystal nickel nanocutting were studied by molecular dynamics simulation to reveal the material removal mechanism. The results showed that the ordered nickel atoms were removed as amorphous structure by tool extrusion and shear during nano-cutting of single crystal nickel. Some of the nickel atoms with FCC structure were transformed into HCP structure and amorphous structure, dominating the phase transition and amorphization. Meanwhile, there appeared dislocation of 1/6<112>, 1/3<100>, 1/6<110>, 1/3<111> and 1/2<110> of the Bergdahl vectors appeared, respectively. The plastic deformation mechanisms were phase transition, amorphization and dislocation slip during nano-cutting of single crystal nickel. A dislocation reaction in which 1/2<110> perfect dislocations were transformed into 1/6<112> partial dislocations occurred due to the fact that the geometrical and energetic conditions were satisfied simultaneously during nano-cutting. The defect structures including dislocation ring, stair-rod dislocation, prismatic dislocation, V-shaped dislocation, atomic cluster and vacancy were observed on the machined subsurface under the action of cutting force-heat. The cutting along the (111) crystal plane was favorable to reduce the depth of the subsurface defect layer compared with the (100) crystal plane and the (110) crystal plane.

     

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