Abstract: Inorganic non-metallic brittle materials are widely used in the fields of electronic information, aerospace and new energy and so on. With high requirements for the surface quality and dimensional accuracy of finished products, it is difficult to achieve efficient and low damage grinding. Ultrasonic vibration assisted grinding (UVAG) can effectively reduce the grinding force. However, it is urgent to reveal the mechanical behavior of the abrasive/workpiece interface. Based on this, the paper firstly analyzed interaction between abrasive particles and brittle materials in indentation experiment, and revealed the material removal mechanism of UVAG brittle materials. Secondly, the modeling process of grinding force is derived by combining the geometry, material removal rate (MRR) model and ductile-brittle transition (DBT) model, the error comparison and source analysis of grinding force models are carried out. Furthermore, the effects of ultrasonic vibration on undeformed chip thickness, grinding force and active abrasive number were studied. Finally, the application of damage evolution and mechanical behavior in brittle material grinding is prospected, providing technical support and theoretical guidance for industry.