Abstract: To study the influence of abrasive self-wear and grinding process parameters on the surface damage of silicon carbide ceramic grinding, a Voronoi polycrystalline silicon carbide ceramic model was established, and a single abrasive scratch simulation was carried out. The correctness of the model was proved by verifying the specific simulation results with experimental scraping. The simulation results show that the worn abrasive grains generate more cracks during the grinding process compared with the unworn abrasive grains, and the more severe the wear degree of the abrasive grains, the more cracks will be generated during grinding. The grinding depth has the strongest influence on the grinding damage of polycrystalline silicon carbide ceramics compared to the grinding speed. The grinding depth in the ductile domain of polycrystalline silicon carbide ceramics is approximately 0.16 μm.