阶梯孔内表面分时分区电解抛光工艺研究

Research on time-sharing and zoning electrochemical polishing of inner surfaces of stepped hole

  • 摘要: 在电解抛光金属阶梯孔时,常出现阶梯孔内拐角区表面粗糙、大小孔内壁粗糙程度不一致等现象。为解决上述问题,提出一种分时分区电解抛光工艺,通过带凸缘的上下分段式工具阴极设计和加工电源脉冲输出的时序调控等措施,实现对阶梯孔内表面的分时分区电解抛光。多物理场耦合仿真及工艺试验结果表明,分时分区电解抛光可以有效解决阶梯孔大小孔内壁表面质量不一致的问题,凸缘阴极也同时一定程度减小了内拐角区域的表面粗糙度。在给定的电解抛光试验条件下,采取正向冲液、脉冲峰值电压24 V、脉冲切换频率1 kHz等工艺参数,可将阶梯孔大小孔的内壁表面均抛至光亮,其表面粗糙度Ra控制在3.5~4.2 μm,且内拐角区域的表面粗糙度Ra可由常规电解抛光的30 μm减小至17 μm。

     

    Abstract: In traditional electrochemical polishing of metallic workpieces with stepped hole features, the surface polishing quality around the inner corner area is significantly worse than those in other areas, and there is a large disparity in surface quality between the surfaces of big hole and small hole after polishing. To improve these problems, a method of time-sharing and zoning electrochemical polishing was proposed, which achieves time-sharing and zoning electrochemical polishing of the inner wall of stepped holes through measures such as the design of a segmented tool cathode with convex edge and the timing regulation of output pulses. The results of multi-physics coupling simulation and experiments show that time-sharing and zoning electrochemical polishing can effectively solve the problem of disparity in surface quality between the surfaces of big hole and small hole, and the cathode with convex edge also reduces the surface roughness of the inner corner area to a certain extent. Under the given electrochemical polishing experimental conditions, by using the machining parameters of pulse peak voltage of 24 V and pulse switching frequency of 1 kHz with forward electrolyte flushing, all the inner surfaces of stepped holes can be polished to a bright and smooth state, with surface roughness around ranging from Ra 3.5 μm to 4.2 μm. Moreover, the surface roughness of the inner corner area can be reduced from around Ra 30 μm using the traditional electrochemical polishing to Ra 17 \textμm with the method of time-sharing and zoning electrochemical polishing.

     

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