Abstract: The grinding process of Cu/diamond composites was simulated using a single conical diamond abrasive grain model, under varying cutting paths and process parameters. It was found that the damage mechanism of the composites depends on the cutting path of the abrasive grain. When the cutting path passed over the top of a diamond reinforcement particle, particle fracture and cracking were primarily observed. When the path passed over the upper part of a particle, cracks and pits were mainly generated. A cutting path over the lower part of a particle resulted in surface pits, while a path beneath the particle led to surface pits along with particle pull-out. Under otherwise constant conditions, the grinding force increases with grinding depth and decreases with grinding speed, with depth exerting the stronger influence; surface roughness increases with grinding depth and decreases with grinding speed. At a grinding speed of 15.7 m/s and a grinding depth of 5 μm, the minimum surface roughness of the workpiece is 0.485 μm.