Abstract: Carbon fiber resin-based composites present numerous challenges in circuit fabrication due to their high surface roughness and anisotropic characteristics. A field-driven 3D printing method was employed to fabricate circuits on this substrate. Experimental observations revealed the influence of fiber bundle spacing and printing nozzle on electric field intensity, elucidating the impact of process parameters such as printing voltage and speed on circuit accuracy and line width uniformity. Circuits with a minimum line width of 138 μm were successfully fabricated. The produced sample exhibited a resistance of 0.5 Ω, reached a peak temperature of 82 °C at 3 V, and completed the de-icing process within 60 s. These findings provide a theoretical foundation for integrated circuit fabrication on carbon fiber resin substrates.