Abstract: Recent advances in in-situ measurement techniques for dynamic material deformation during cutting are reviewed, with particular emphasis on orthogonal cutting experimental platforms, in-situ imaging systems, and deformation field calculation based on image processing techniques. Firstly, the development strategies of different types of orthogonal cutting experimental platforms are summarized, together with their advantages in cutting mechanism investigation and in-situ measurement of cutting process. Subsequently, the configurations of single-optical-path and dual-optical-path in-situ imaging systems are analyzed. Their application characteristics in capturing the dynamic deformation behavior and chip formation process within the cutting zone are discussed. Finally, the calculation methods for multi-physical fields in the deformation zone based on image processing techniques are reviewed, particularly the progress in synchronous measurement of kinematic fields and thermo-mechanical fields. The review indicates that in-situ measurement technologies facilitate the transition of cutting mechanism research from macroscopic result analysis toward microscopic mechanism interpretation, thereby providing important experimental data for revealing the mechanisms of plastic deformation, local instability, and fracture during material removal. In the future, this research field is expected to continue advancing toward higher spatiotemporal resolution, synchronous multi-physical field measurement, and intelligent image analysis.