张高振, 朱祥龙, 董志刚, 康仁科, 赵杨. 光电化学机械抛光装置设计[J]. 制造技术与机床, 2023, (2): 40-45. DOI: 10.19287/j.mtmt.1005-2402.2023.02.005
引用本文: 张高振, 朱祥龙, 董志刚, 康仁科, 赵杨. 光电化学机械抛光装置设计[J]. 制造技术与机床, 2023, (2): 40-45. DOI: 10.19287/j.mtmt.1005-2402.2023.02.005
ZHANG Gaozhen, ZHU Xianglong, DONG Zhigang, KANG Renke, ZHAO Yang. Photoelectrochemical mechanical polishing device design[J]. Manufacturing Technology & Machine Tool, 2023, (2): 40-45. DOI: 10.19287/j.mtmt.1005-2402.2023.02.005
Citation: ZHANG Gaozhen, ZHU Xianglong, DONG Zhigang, KANG Renke, ZHAO Yang. Photoelectrochemical mechanical polishing device design[J]. Manufacturing Technology & Machine Tool, 2023, (2): 40-45. DOI: 10.19287/j.mtmt.1005-2402.2023.02.005

光电化学机械抛光装置设计

Photoelectrochemical mechanical polishing device design

  • 摘要: 针对第三代半导体材料氮化镓(GaN)光电化学机械抛光的加工需求,研制了具有紫外光照射、电压加载和机械抛光功能的光电化学机械抛光(PECMP)装置。设计了紫外光可直接照射到GaN晶片表面的抛光盘单元,加工区稳定加载电压且与装置绝缘的电气回路,抛光盘和工件盘能够独立回转的驱动机构,并且抛光盘可以往复移动、抛光压力可以可调加载。建立了PECMP装置的整机三维模型,通过静力学分析和模态分析,优化了抛光盘和龙门等关键部件结构。搭建了PECMP抛光装置,并进行了性能测试,实现了可施加的光照强度0~200 mW·cm−2,电压大小0~10±0.1 V,绝缘电阻150 MΩ,抛光盘转速10~100 r/min,工件转速10~200 r/min,抛光盘往复移动速度1~100 mm/s,压力加载范围0~200 N,满足2英寸GaN晶片的PECMP加工需求。

     

    Abstract: In response to the processing needs of photoelectrochemical mechanical polishing of the third-generation semiconductor material gallium nitride (GaN), an optoelectronic chemical mechanical polishing (PECMP) device with ultraviolet light irradiation, voltage loading and mechanical polishing functions was developed. The polishing disc unit with ultraviolet light directly shining on the surface of the GaN wafer, and the electrical circuit with stable loading voltage in the processing area and insulated from the device was designed. The driving mechanism was designed which has independent rotation of polishing disc and workpiece disc, reciprocating movement of polishing disc and adjustable loading of polishing pressure. The three-dimensional model of the whole PECMP device was established, and the structure of key components such as polishing disc and gantry was optimized through static analysis and modal analysis. The PECMP polishing device was built and the performance test was carried out. In the test, the applied light intensity was 0~200 mW·cm−2, the voltage size was 0~10±0.1 V, the insulation resistance was 150 MΩ, the polishing disc speed was 10~100 r/min, the workpiece speed was 10~200 r/min, the polishing disc reciprocating moving speed was 1~100 mm/s, and the pressure loading range was 0~200 N, which met the PECMP processing needs of 2-inch GaN wafers.

     

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