Experimental study on the material removal mechanism in ultrasonic assisted grinding of zirconia ceramics
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摘要: 为研究超声振动作用对先进陶瓷磨削材料去除机理的影响，文章在超声振动方向垂直于磨削表面条件下，采用钎焊磨头对氧化锆陶瓷开展了超声辅助磨削（ultrasonic assisted grinding，UAG）试验。基于磨削表面微观形貌、磨削力和磨削比能分析，对变磨削深度条件下普通磨削（conventional grinding，CG）与超声辅助磨削的材料去除机理进行了对比。结果表明：当磨削深度低于10 μm时，两种方法对应的表面材料去除机理均以塑性去除为主，且普通磨削表面伴有片层状破碎，而超声辅助磨削表面则存在尺寸细小的纹路状微破碎，同时磨削力与磨削比能也较低。当磨削深度超过10 μm后，材料去除机理均转变为脆性断裂模式，且加工表面出现微裂纹，但相同条件下超声辅助磨削表面微裂纹尺寸较小。Abstract: In order to study the effect of ultrasonic vibration on the material removal mechanism during grinding of advanced ceramics, the ultrasonic assisted grinding (UAG) test of zirconia ceramics was carried out by brazing grinding head with ultrasonic vibration direction perpendicular to the grinding surface. Based on the analysis of the ground surface micromorphology, grinding force and grinding specific energy, the material removal mechanism of conventional grinding (CG) and UAG under variable grinding depth is compared. The results show that when the grinding depth is less than 10 μm, the material removal mechanism caused by CG and UAG is mainly plastic mode, and the surface produced by CG is accompanied by lamellar fracture, while UAG has smaller grain-like micro fracture. In addition, UAG also caused lower grinding force and grinding specific energy. When the grinding depth exceeds 10 μm, the material removal mechanism is transformed into a brittle fracture mode, and micro-cracks appear on the ground surface, but the size produced by UAG is smaller than CG under the same conditions.
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