SUN Feng, WANG Yibin, SONG Kaihua, HU Haiming, LI Lin. Performance analysis of movable mold pattern block based on sequential thermodynamic coupling[J]. Manufacturing Technology & Machine Tool, 2022, (12): 88-93. DOI: 10.19287/j.mtmt.1005-2402.2022.12.014
Citation: SUN Feng, WANG Yibin, SONG Kaihua, HU Haiming, LI Lin. Performance analysis of movable mold pattern block based on sequential thermodynamic coupling[J]. Manufacturing Technology & Machine Tool, 2022, (12): 88-93. DOI: 10.19287/j.mtmt.1005-2402.2022.12.014

Performance analysis of movable mold pattern block based on sequential thermodynamic coupling

  • In this paper, the inclined plane X1188 type tire active die is taken as an example, and the whole sequential thermodynamic coupling analysis of the active die is carried out with the help of ABAQUS finite element analysis software. The stress displacement distribution of the pattern block and the stress-position curve of the inner surface and side of the pattern block are obtained during the vulcanization process of the active die. Through the adjustable die structure improvement and optimization, change the pattern block size height, pattern and decorative pattern blocks of the joint surface between width, pattern blocks and bow adopt different ways of cooperation, the comparison of different pattern block under the condition of the stress and displacement of the finite element analysis results, it is concluded that the stress and displacement distribution change law, can provide the reference for die design.
  • loading

Catalog

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return