LIN Jieqiong, YAN Dong, LU Mingming, LI Jiacheng, GAO Xin. Temperature simulation of ultrasonic assisted cutting of three-dimensional SiCp/Al composites[J]. Manufacturing Technology & Machine Tool, 2023, (1): 36-43. DOI: 10.19287/j.mtmt.1005-2402.2023.01.005
Citation: LIN Jieqiong, YAN Dong, LU Mingming, LI Jiacheng, GAO Xin. Temperature simulation of ultrasonic assisted cutting of three-dimensional SiCp/Al composites[J]. Manufacturing Technology & Machine Tool, 2023, (1): 36-43. DOI: 10.19287/j.mtmt.1005-2402.2023.01.005

Temperature simulation of ultrasonic assisted cutting of three-dimensional SiCp/Al composites

  • Aluminum-based silicon carbide (SiCp/Al) composites have been widely used in aerospace, automobile production and other fields because of their excellent properties. In order to deeply understand the cutting mechanism of ultrasonic vibration-assisted turning SiCp/Al, a three-dimensional simulation model of ultrasonic vibration-assisted turning SiCp/Al was established by using finite element simulation software ABAQUS, and the particle, matrix and cohesion models were defined respectively. According to the established three-dimensional model simulation, the SiCp/Al cutting temperatures with different cutting speeds, cutting depths, tool amplitudes and tool vibration frequencies are analyzed respectively. From the simulation results, it can be seen that when cutting SiCp/Al by ultrasonic vibration, the temperature of SiC particles is generally lower than that of Al matrix, and the temperature of workpiece is directly proportional to cutting speed, cutting depth and amplitude of cutter, but the temperature will decrease with the increase of cutter vibration frequency, and the cutting temperature in shear band is the highest.
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