LIU Zhipeng, FU Xiuli, JIANG Zhenfeng, LIANG Xinyu, PAN Yan’an, PAN Yongzhi. A review of the application research of ultrasonic elliptical vibration cutting device[J]. Manufacturing Technology & Machine Tool, 2025, (4): 87-95. DOI: 10.19287/j.mtmt.1005-2402.2025.04.012
Citation: LIU Zhipeng, FU Xiuli, JIANG Zhenfeng, LIANG Xinyu, PAN Yan’an, PAN Yongzhi. A review of the application research of ultrasonic elliptical vibration cutting device[J]. Manufacturing Technology & Machine Tool, 2025, (4): 87-95. DOI: 10.19287/j.mtmt.1005-2402.2025.04.012

A review of the application research of ultrasonic elliptical vibration cutting device

  • Ultrasonic elliptical vibration cutting (UEVC) technology can obtain low surface roughness and textures of different shapes. In order to meet different processing requirements, various types of UEVC devices have been designed and manufactured. The UEVC devices are classified and analyzed according to different excitation methods, and the generation principles of elliptical trajectories of resonant and non-resonant UEVC devices is summarized, the application fields of various UEVC devices are clarified, and the UEVC devices are summarized and prospected, which provides directions for subsequent device design and optimization.
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