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CUI Fangfang, DING Kai, LIU Sheng, LI Qilin, HE Bin. Experimental study on the material removal mechanism in ultrasonic assisted grinding of zirconia ceramics[J]. Manufacturing Technology & Machine Tool, 2024, (4): 78-83. doi: 10.19287/j.mtmt.1005-2402.2024.04.012
Citation: CUI Fangfang, DING Kai, LIU Sheng, LI Qilin, HE Bin. Experimental study on the material removal mechanism in ultrasonic assisted grinding of zirconia ceramics[J]. Manufacturing Technology & Machine Tool, 2024, (4): 78-83. doi: 10.19287/j.mtmt.1005-2402.2024.04.012
shu

Experimental study on the material removal mechanism in ultrasonic assisted grinding of zirconia ceramics

doi: 10.19287/j.mtmt.1005-2402.2024.04.012
  • 1.

    School of Automobile and Traffic Engineering, Jiangsu University of Technology, Changzhou 213001, CHN

  • 2.

    School of Mechanical Engineering, Jiangsu University of Technology, Changzhou 213001, CHN

  • Accepted Date: 2024-01-11
  • Rev Recd Date: 2023-10-22
    Abstract
  • In order to study the effect of ultrasonic vibration on the material removal mechanism during grinding of advanced ceramics, the ultrasonic assisted grinding (UAG) test of zirconia ceramics was carried out by brazing grinding head with ultrasonic vibration direction perpendicular to the grinding surface. Based on the analysis of the ground surface micromorphology, grinding force and grinding specific energy, the material removal mechanism of conventional grinding (CG) and UAG under variable grinding depth is compared. The results show that when the grinding depth is less than 10 μm, the material removal mechanism caused by CG and UAG is mainly plastic mode, and the surface produced by CG is accompanied by lamellar fracture, while UAG has smaller grain-like micro fracture. In addition, UAG also caused lower grinding force and grinding specific energy. When the grinding depth exceeds 10 μm, the material removal mechanism is transformed into a brittle fracture mode, and micro-cracks appear on the ground surface, but the size produced by UAG is smaller than CG under the same conditions.

     

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